1.

国際会議録
国際会議録
1. Evolution of Topography During First Step CMP of Cu-Plated Damascene Structures
Hymes, Steve ; Brown, Tom ; LeFevre, Paul ; Mikkola, Bob ; Emesh, Ishmail ; Bajaj, Rajeev ; Smekalin, Konstantin ; Ma, Yutao ; Redeker, Fritz ; Park, Tae ; Tugbawa, Tamba ; Boning, Duane ; Nguyen, John
出版情報: Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium.  pp.149-157,  1999.  Pennington, N. J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 99-37
2.

国際会議録
国際会議録
2. Modeling of Pattern Dependencies for Multi-Level Copper Chemical-Mechanical Polishing Processes
Tugbawa, Tamba ; Park, Tae ; Lee, Brian ; Boning, Duane ; Lefevre, Paul ; Camilletti, Lawrence
出版情報: Chemical-mechanical polishing 2001 -- advances and future challenges : symposium held April 18-20, 2001, San Francisco, California, U.S.A..  2001.  Warrendale, PA.  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 671
3.

国際会議録
国際会議録
3. Multi-level Pattern Effects in Copper CMP
Park, Tae ; Tugbawa, Tamba ; Boning, Duane ; Hymes, Steve ; Lefevre, Paul ; Brown, Tom ; Smekalin, Konstantin ; Schwartz, Gary
出版情報: Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium.  pp.94-100,  1999.  Pennington, N. J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 99-37
4.

国際会議録
国際会議録
4. A Mathematical Model of Pattern Dependencies in Cu CMP Processes
Tugbawa, Tamba ; Park, Tae ; Boning, Duane ; Pan, Tony ; Li, Ping ; Hymes, Steve ; Brown, Tom ; Camilletti, Lawrence
出版情報: Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium.  pp.605-615,  1999.  Pennington, N. J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 99-37
5.

国際会議録
国際会議録
5. Direct Measurement of Planarization Length for Copper Chemical Mechanical Planarization Polishing (CMP) Processes Using A Large Pattern Test Mask
Lefevre, Paul ; Gonzales, Albert ; Brown, Tom ; Martin, Gerald ; Tugbawa, Tamba ; Park, Tae ; Boning, Duane ; Gostein, Michael ; Nguyen, John
出版情報: Chemical-mechanical polishing 2001 -- advances and future challenges : symposium held April 18-20, 2001, San Francisco, California, U.S.A..  2001.  Warrendale, PA.  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 671
6.

国際会議録
国際会議録
6. Characterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE)
Sun, Hongwei ; Hill, Tyrone ; Schmidt, Martin ; Boning, Duane
出版情報: Micro- and nanosystems : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A..  pp.435-440,  2004.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 782
7.

国際会議録
国際会議録
7. Re-Examining the Physical Basis of Pattern Density and Step Height CMP Models
Xie, Xiaolin ; Park, Tae ; Lee, Brian ; Tugbawa, Tamba ; Cai, Hong ; Boning, Duane
出版情報: Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A..  pp.15-20,  2003.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 767
8.

国際会議録
国際会議録
8. Integrated Chip-Scale Prediction of Copper Interconnect Topography
Park, Tae ; Tugbawa, Tamba ; Cai, Hong ; Xie, Xiaolin ; Boning, Duane ; Chidambaram, Chidi ; Borst, Chris ; Shinn, Greg
出版情報: Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A..  pp.337-344,  2003.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 767
9.

国際会議録
国際会議録
9. CMP at the Wafer Edge -- Modeling the Interaction Between Wafer Edge Geometry and Polish Performance
Xie, Xiaolin ; Boning, Duane
出版情報: Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A..  pp.223-234,  2005.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 867
10.

国際会議録
国際会議録
10. Characterizing STI CMP Processes With an STI Test Mask Having Realistic Geometric Shapes
Xie, Xiaolin ; Park, Tae ; Boning, Duane ; Smith, Aaron ; Allard, Paul ; Patel, Neil
出版情報: Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.275-282,  2004.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 816