1.

国際会議録
国際会議録
1. 70 Reactive Diffusion in the Ni-Si System: Influence of Ni Thickness on the Phase Formation Sequence
Coia, C. ; Lavoie, C. ; d'Heurle, F. M. ; Desjardins, P. ; Detavernier, C. ; Kellock, A. J. (Invited Paper)
出版情報: Advanced gate stack, source/drain and channel engineering for Si-based CMOS, new materials, processes, and equipment : proceedings of the international symposium.  pp.585-596,  2005.  Pennington, NJ.  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 2005-05
2.

国際会議録
国際会議録
2. Texture in Thin Films
Detavernier, C. ; Lavoie, C.
出版情報: Textures of materials : ICOTOM 14 : Proceedings of the 14th International Conference on Textures of Materials, held in Leuven, Belgium, July 11-15, 2005.  pp.1333-1342,  2005.  Uetikon-Zuerich, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 495-497(2)