1.

国際会議録
国際会議録
1. Effectiveness of Residual Stress on Forming Copper Patterns of Printed Circuit Board
H.S. Lee ; H.C. Kwon
出版情報: PRICM 7 : selected peer review papers from the seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia.  pp.2716-2719,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 654-656
2.

国際会議録
国際会議録
2. Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material
J.S. Shin ; H.K. Moon ; B.H. Kim ; H.S. Lee ; H.C. Kwon
出版情報: PRICM 7 : selected peer review papers from the seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia.  pp.2728-2731,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 654-656
3.

国際会議録
国際会議録
3. The Effects of Heat Treatment on the Bonding Strength of Surface-Activated Bonding (SAB)-Treated Copper-Nickel Fine Clad Metals
K.H. Kim ; S.C. Lim ; H.C. Kwon
出版情報: PRICM 7 : selected peer review papers from the seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia.  pp.1932-1935,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 654-656