Electrochemical and Frictional Behaviors of Cu Surface in Organic Acid Based Slurries During Copper CMP
- 著者名:
Eom, D.-H. Ryu, J.-S. Hong, Y.-K. Myung, J.-J. Kim, K.-S. Park, J.-G. - 掲載資料名:
- Chemical Mechanical Planarization : proceedings of the International Symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2003-21
- 発行年:
- 2003
- 開始ページ:
- 44
- 終了ページ:
- 51
- 総ページ数:
- 8
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774048 [1566774047]
- 言語:
- 英語
- 請求記号:
- E23400/200321
- 資料種別:
- 国際会議録
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5
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THE EFFECTS OF pH ADJUSTORS IN POST Cu CMP CLEANING SOLUTIONS ON PARTICLE ADHESION AND REMOVAL
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