Inelastic strain analysis of solder joint in NASA fatigue specimen

Inelastic strain analysis of solder joint in NASA fatigue specimen

著者名:

Dasgupta, Abhijit ( Maryland Univ. )
Oyan, Chen ( Maryland Univ. )

掲載資料名:

NASA Technical Reports

発行年:

1991

号:

NASA-CR-187864

パート:

NAS 1.26:187864

ペーパー番号:

N91-16132

開始ページ:

1

終了ページ:

60

総ページ数:

60

出版情報:

National Aeronautics and Space Adminstration

言語:

英語

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:

ZA00001427

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1 テクニカルペーパー INELASTIC STRAIN ANALYSIS OF SOLDER JOINT IN NASA FATIGUE SPECIMEN Dasgupta, Abhijit National Aeronautics and Space Adminstration	7 テクニカルペーパー Fatigue analysis of a planarpak surface mount component Sharif, Irfan, Barker, Donald B., Dasgupta, Abhijit, Pecht, Michael G. The American Society of Mechanical Engineers
2 テクニカルペーパー Solder creep-fatigue analysis by an energy-partitioning approach Dasgupta, A., Oyan, C., Barker, D., Pecht, M. The American Society of Mechanical Engineers	8 テクニカルペーパー A nonlinear multi-domain themomechanical stress analysis method for surface-mount solder joints: Part II: Viscoplastic analysis Ling, S., Dasgupta, A. The American Society of Mechanical Engineers
3 テクニカルペーパー Effect of SMC lead dimensional variabilities on lead compliance and solder joint fatigue life Barker, Donald B., Sharif, Irfan, Dasgupta, Abhijit, Pecht, M. G. The American Society of Mechanical Engineers	9 テクニカルペーパー Stress analysis of glass-to-metal lead seals Mathieu, Barry, Dasgupta, Abhijit The American Society of Mechanical Engineers
4 テクニカルペーパー Fatigue life of misregistered J-lead solder joints through an energy-partitioning analysis Dasgupta, A., Verma, S., Barker, D. The American Society of Mechanical Engineers	10 テクニカルペーパー A nested finite element methodology (NFEM) for stress analysis of flip chip on board assemblies - part II: Viscoplastic analysis Darbha, Krishna, Dasgupta, Abhijit The American Society of Mechanical Engineers
5 テクニカルペーパー A nonlinear multi-domain stress analysis method for surface-mount solder joints Ling, S., Dasgupta, A. The American Society of Mechanical Engineers	11 テクニカルペーパー Use of backface strain to monitor fatigue crack initiation in solder joints Zhang, Zhehua, Yao, Daping, Shang, J. K. The American Society of Mechanical Engineers
6 テクニカルペーパー Viscoplastic characterization of constitutive behavior of two solder alloys Haswell, Peter, Dasgupta, Abhijit The American Society of Mechanical Engineers	12 テクニカルペーパー Fatigue Analysis of Swept Friction Stir Clinch Joints between Aluminum and Steel Sheets Pai-Chen Lin, WeiNing Chen Society of Automotive Engineers

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