Effect of Bonding Temperature on Microstructure Development during Transient Liquid Phase Bonding of Ti2AlNb Alloy Using Ti-Zr-Cu Based Filler Alloy

Effect of Bonding Temperature on Microstructure Development during Transient Liquid Phase Bonding of Ti2AlNb Alloy Using Ti-Zr-Cu Based Filler Alloy

著者名:

掲載資料名:

IUMRS International Conference in Asia

シリーズ名:

Materials science forum

シリーズ巻号:

898

発行年:

2017

パート:

2

開始ページ:

1247

終了ページ:

1253

総ページ数:

7

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035711516 [3035711518]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00066570
シリーズID:	PA00000012
会議名:	IUMRS International Conference in Asia (IUMRS-ICA)
回次:	2016
会議開催地:	Qingdao, China
会議開催年:	2016.10.20-2016.10.24
論文注記:	IUMRS International Conference in Asia (IUMRS-ICA), Qingdao, China, October 20-24, 2016

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