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Effect of Bonding Temperature on Microstructure Development during Transient Liquid Phase Bonding of Ti2AlNb Alloy Using Ti-Zr-Cu Based Filler Alloy

著者名:
掲載資料名:
IUMRS International Conference in Asia
シリーズ名:
Materials science forum
シリーズ巻号:
898
発行年:
2017
パート:
2
開始ページ:
1247
終了ページ:
1253
総ページ数:
7
出版情報:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783035711516 [3035711518]
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

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