Blank Cover Image

Effect of Compound Modification and Cooling Rate on Microstructure and Mechanical Properties of Al-25%Si Alloy

著者名:
H.T. Zhang
D.T. Wang
K. Qin
X. Han
B. Shao
K.S. Zuo
J.Z. Cui
さらに 2 件
掲載資料名:
The 15th International Conference on Aluminium Alloys: ICCA15
シリーズ名:
Materials science forum
シリーズ巻号:
877
発行年:
2017
開始ページ:
27
終了ページ:
32
総ページ数:
6
出版情報:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783035710502 [3035710503]
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

類似資料:

H.T. Zhang, D.T. Wang, K. Qin, X. Han, B. Shao

Trans Tech Publications

D.T. Wang, H.T. Zhang, K. Qin, X. Han, B. Shao, K.S. Zuo, J.Z. Cui

Trans Tech Publications

Q.C. Le, Z.Q. Zhang, J.Z. Cui, Z. Jia

Trans Tech Publications

D.T. Wang, H.T. Zhang, K. Qin, X. Han, B. Shao

Trans Tech Publications

J.Z. Cui, H.T. Zhang, Y.B. Zuo

Trans Tech Publications

X. Han, B. Shao, H.T. Zhang, K. Qin, J.Z. Cui

Trans Tech Publications

K. Qin, H.T. Zhang, J.Z. Cui, H.X. Jiang

Trans Tech Publications

Xing HAN, Bo SHAO, Ke-sheng ZUO, Lin JIANG, Hai-tao ZHANG, Li-zi HE, Ke QIN, Jian-zhong CUI

Editorial Office of Trans. NFsoc., Central-South University of Technology

J.Y. Jiao, Q.Z. Shen, A.C. Cheng, R.F. Guo, T.T. Zhou

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12