Environment-Friendly Chemical Mechanical Polishing Slurry for SiC Wafer

Environment-Friendly Chemical Mechanical Polishing Slurry for SiC Wafer

著者名:

掲載資料名:

Advances in Abrasive Technology XIX

シリーズ名:

Materials science forum

シリーズ巻号:

874

発行年:

2016

開始ページ:

415

終了ページ:

422

総ページ数:

8

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035710342 [3035710341]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00066546
シリーズID:	PA00000012
会議名:	International Symposium on Advances in Abrasive Technology (ISAAT 2016)
回次:	19th
会議開催地:	Stockholm, Sweden
会議開催年:	2016.10.02-2016.10.05
論文注記:	19th International Symposium on Advances in Abrasive Technology (ISAAT 2016), Stockholm, Sweden, October 2-5, 2016

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