539g. Electrochemical Impedance Studies Of Copper Surface Reactions During Chemical Mechanical Planarization

539g. Electrochemical Impedance Studies Of Copper Surface Reactions During Chemical Mechanical Planarization

著者名:

掲載資料名:

2007 AIChE annual meeting : Salt Palace Convention Center, Salt Lake City, Utah, November 4-9, 2007 : conference proceedings. Non-Topical Conference

シリーズ名:

AIChE Conference Proceedings

シリーズ巻号:

P-246

発行年:

2007

パート:

1

開始ページ:

P95019

出版情報:

New York: American Institute of Chemical Engineers

ISBN:

9780816910229 [0816910227]

言語:

英語

請求記号:

A08000/2007 [CD-ROM]

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00061214
シリーズID:	PA00000008
会議名:	AIChE Annual Meeting ; Particle Technology Forum ; North American Mixing Forum ; Computational Molecular Science and Engineering Forum ; Nanoscale Science and Engineering Forum ; Sustainable Engineering Forum
回次:	2007
会議開催地:	Salt Lake City, UT, USA
会議開催年:	2007.11.04-2007.11.09
論文注記:	[html file] 2007 AIChE annual meeting, Salt Palace Convention Center, Salt Lake City, Utah, November 4-9, 2007. Engineering Sciences and Fundamentals

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