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Atomistic Study of the Copper Cluster Deposition on Si(001) and Si(111) Surface

著者名:
掲載資料名:
Methods of Design and Characterization of Materials, Research and Development of Technological Processes : selected, peer reviewed papers from the Chinese Materials Conference 2015, July 10-14, 2015, Guiyang, China
シリーズ名:
Materials science forum
シリーズ巻号:
850
発行年:
2016
開始ページ:
287
終了ページ:
298
総ページ数:
12
出版情報:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783038357629 [3038357626]
言語:
英語
請求記号:
M23650 [v.850]
資料種別:
国際会議録

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