Microstructure Evolution at the Diffusion Bonding Interface of High Nb Containing TiAl Alloy

Microstructure Evolution at the Diffusion Bonding Interface of High Nb Containing TiAl Alloy

著者名:

掲載資料名:

Basic Research of Materials : Selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China

シリーズ名:

Materials science forum

シリーズ巻号:

817

発行年:

2015

開始ページ:

599

終了ページ:

603

総ページ数:

5

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054281
シリーズID:	PA00000012
会議名:	Chinese Materials Congress 2014 (CMC 2014)
回次:	2014
会議開催地:	Chengdu, China
会議開催年:	2014.07.04-2014.07.07
論文注記:	Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China

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