Effects of Cu Contamination on the Electrical Properties of Multicrystalline Silicon Purified by Directional Solidification Route

Effects of Cu Contamination on the Electrical Properties of Multicrystalline Silicon Purified by Directional Solidification Route

著者名:

掲載資料名:

2014 China Functional Materials Technology and Industry Forum : Selected, peer reviewed papers from the 2014 China Functional Material Technology and Industry Forum (CFMTIF 2014), August 26-28, 2014, Xi'an, China

シリーズ名:

Materials science forum

シリーズ巻号:

809-810

発行年:

2015

開始ページ:

846

終了ページ:

854

総ページ数:

9

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054274
シリーズID:	PA00000012
会議名:	China Functional Material Technology and Industry Forum (CFMTIF 2014)
回次:	2014
会議開催地:	Xi'an, China
会議開催年:	2014.08.26-2014.08.28
論文注記:	2014 China Functional Material Technology and Industry Forum (CFMTIF 2014), August 26-28, 2014, Xi'an, China

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