Blank Cover Image

Microstructure and Reaction Mechanism of Multi-Laminated Ti-(SiCp/Al) Composites Subjected to Annealing at 1300°C

著者名:
掲載資料名:
Physical and numerical simulation of materials processing VII : selected, peer reviewed papers from the 7th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS'13), June 16-19, 2013, Oulu, Finland
シリーズ名:
Materials science forum
シリーズ巻号:
762
発行年:
2013
開始ページ:
526
終了ページ:
530
総ページ数:
5
出版情報:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

類似資料:

G.H. Fan, Z.Z. Zheng, J.C. Pang, L. Geng

Trans Tech Publications

Chen, J., Geng, Z., Chin, B.A.

Materials Research Society

M.L. Li, Y.J. Geng, C. Chen, S.J. Pang, T. Zhang

Trans Tech Publications

Q.W. Wang, Y.C. Feng, G.H. Fan, G.S. Wang, L. Geng

Trans Tech Publications

B.X. Liu, L. Geng, X.L. Dai, F.X. Yin, L.J. Huang

Trans Tech Publications

L.J. Huang, Y.Z. Zhang, L. Geng

Trans Tech Publications

L. Song, X.J. Xu, J.P. Lin, L.Q. Zhang

Trans Tech Publications

J.J. Zheng, T.W.L. Ngai, C.X. Hu, G.R. Pan, Y.Y. Li

Trans Tech Publications

L. Geng, H.L. Wang, Y.B. Song, J. Zhang

Trans Tech Publications

T.W.L. Ngai, H.G. Luo, J.J. Zheng, C.X. Hu, Y.Y. Li

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12