Fabrication of a SiC-Ti Functionally Graded Bonding Interlayer by Precursor Method

Fabrication of a SiC-Ti Functionally Graded Bonding Interlayer by Precursor Method

著者名:

掲載資料名:

Advances in Functional and Electronic Materials : Selected, peer reviewed papers from the Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China

シリーズ名:

Materials science forum

シリーズ巻号:

745-746

発行年:

2013

開始ページ:

696

終了ページ:

699

総ページ数:

4

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054225
シリーズID:	PA00000012
会議名:	Chinese Materials Congress (CMC 2012)
回次:	2012
会議開催地:	Taiyuan, China
会議開催年:	2012.07.13-2012.07.18
論文注記:	Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China

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