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Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives

著者名:
掲載資料名:
Advanced manufacture : focusing on new and emerging technologies : selected peer reviewed papers from the 2007 International Conference on Advanced Manufacture, Tainan, Taiwan, R.O.C., November 26-November 28, 2007
シリーズ名:
Materials science forum
シリーズ巻号:
594
発行年:
2008
開始ページ:
181
終了ページ:
186
総ページ数:
6
出版情報:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

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