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Effect of Alkaline Agent with Organic Additive in Colloidal Silica Slurry on Polishing Rate Selectivity of Polysilicon-to-SiO2 in Polysilicon CMP

著者名:
掲載資料名:
Chemical Mechanical Polishing 9
シリーズ名:
ECS transactions
シリーズ巻号:
13(4)
発行年:
2008
開始ページ:
67
終了ページ:
73
総ページ数:
7
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781605601816 [1605601810]
言語:
英語
請求記号:
E23400/13-4 [4]
資料種別:
国際会議録

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