Surface Preparation in CMP Process; Post CMP Cleaning and Defects

Surface Preparation in CMP Process; Post CMP Cleaning and Defects

著者名:

掲載資料名:

Cleaning and surface conditioning technology in semiconductor device manufacturing 10

シリーズ名:

ECS transactions

シリーズ巻号:

11(2)

発行年:

2007

開始ページ:

419

終了ページ:

430

総ページ数:

12

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775687 [156677568X]

言語:

英語

請求記号:

E23400/11-2

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013286
シリーズID:	PA00000034
会議名:	ECS Meeting
回次:	212th
会議開催地:	Washington, DC, USA
会議開催年:	2007.10.07-2007.10.12
論文注記:	212th ECS Meeting, October 7 - October 12, 2007, Washington, DC

類似資料:

1 国際会議録 Fundamentals of Post-CMP Cleaning Jin-Goo Park, Tae-Gon Kim Materials Research Society	7 国際会議録 Post-CMP Cleaning: Slurry-Induced Metallic Contaminations on Undoped and Doped Silicate Oxide Surfaces Han, S.H., Kim, S.-y., Ahn, H.-g., Kim, H.-j., Kim, J.-h., Lee, J.-g., Ko, C.-g. Electrochemical Society
2 国際会議録 Post W CMP Cleaning Without HF Cleans Y. Kang, C. Yang, T. Kwon, J. Park, J. Jo Electrochemical Society	8 国際会議録 Mechanisms of Post-CMP Cleaning Liang, H., Estragnat, E., Lee, J., Bahten, K., McMullen, D. Materials Research Society
3 国際会議録 NEW APPROACH FOR STUDY OF PARTICLE ADHESION AND REMOVAL RELEVANT TO POST CMP CLEANING Lee, S.-Y., Lee, S.-H., Eom, D.-H., Kim, K.-S., Song, H.-S., Park, J.-G. Electrochemical Society	9 国際会議録 Chemical Mechanical Cleaning for Post-CMP Applications: Defects and Metals Results Zhao, E. Y., Emami, R., Malik, I., Mishra, K., Krusell, W. C., Larios, J. de, Hymes, D. J. MRS - Materials Research Society
4 国際会議録 Mechanism of a New Post CMP Cleaning for Trench Isolation Process Abe, N., Izumi, T., Kodera, M., Mase, Y., Minami, Y., Miyashita, N., Takayasu, J. Materials Research Society	10 国際会議録 ADVANCED FRONT END OF THE LINE CLEAN FOR POST-CMP PROCESSES Kashkoush, I., Nolan, T., Nemeth, D., Novak, R. Electrochemical Society
5 国際会議録 THE EFFECTS OF pH ADJUSTORS IN POST Cu CMP CLEANING SOLUTIONS ON PARTICLE ADHESION AND REMOVAL Y.-K. Hong, J.-H. Song, Y.-J. Kang, I.-K. Kim, J.-G. Park, H.-S. Song, K.-S. Kim, J.-J. Myung, H.-J. Lee, S.-Y. Song Electrochemical Society	11 国際会議録 Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal Hong, Y.K., Eom, D.H., Lee, S.H., Park, J.G., Busnaina, A.A. Electrochemical Society
6 国際会議録 POST W CMP CLEANING Constant, I., Marthon, S., Lardin, T., David, C., Jacquemond, M.N., Tardif, F. Electrochemical Society	12 国際会議録 Technique Of Surface Control With The Electrolyzed D.I.water For Post CMP Cleaning Shirakashi, M., Itoh, K., Katakabe, I., Kamezawa, M., Kihara, S., Tsujimura, M., Saitoh, T., Yamada, K., Miyashita, N., … Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12