Quantitative Measurement of Pattern Collapse and Particle Removal Force

Quantitative Measurement of Pattern Collapse and Particle Removal Force

著者名:

掲載資料名:

Cleaning and surface conditioning technology in semiconductor device manufacturing 10

シリーズ名:

ECS transactions

シリーズ巻号:

11(2)

発行年:

2007

開始ページ:

123

終了ページ:

129

総ページ数:

7

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775687 [156677568X]

言語:

英語

請求記号:

E23400/11-2

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013286
シリーズID:	PA00000034
会議名:	ECS Meeting
回次:	212th
会議開催地:	Washington, DC, USA
会議開催年:	2007.10.07-2007.10.12
論文注記:	212th ECS Meeting, October 7 - October 12, 2007, Washington, DC

類似資料:

1 国際会議録 Effect of Particle Deposition and Wet/Dry Cleaning Methods on Particle Removal Efficiency T. Kim, S. Hu, A.A. Busnaina, J. Park Electrochemical Society	7 国際会議録 EFFECT OF CORROSION INHIBITOR, lH-BENZOTRJAZOLE (BTAH) ON PARTICLE ADHESION IN Cu CMP J.-H. Song, Y.-K. Hong, T.-G. Kim, Y.-J. Kang, I.-K. Kim, J.-H. Han, J.-G. Park, A. A. Busnaina Electrochemical Society
2 国際会議録 ADHESION AND REMOVAL OF SILICA AND ALUMINA SLURRY PARTICLES DURING Cu CMP PROCESS Park, J., Busnaina, A.A. Electrochemical Society	8 テクニカルペーパー Particle Adhesion and Removal in the Semiconductor Industry. Busnaina, A.A., Xiong, X., Park, J.G. American Society of Mechanical Engineers
3 国際会議録 Nano-particle laser removal from silicon wafers Lee, J.M., Cho, S.H., Kim, T.H., Park, J.-G., Busnaina, A.A. SPIE - The International Society of Optical Engineering	9 国際会議録 NANOSCALE PARTICLES REMOVAL ON AN EXTREME ULTRA-VIOLET LITHOGRAPHY (EUVL) MASK LAYER BY LASERSHOCK CLEANING S.-H. Lee, S.-H Lee, J.-G. Park, A. A. Busnaina, J.-M. Lee, T.-H. Kim, G. Zhang, F. Eschbach, A. Ramamoorthy Electrochemical Society
4 国際会議録 Local Removal Frequency of Nano Particles in Megasonic Cleaning T. Janssens, K.L. Wostyn, S. Arnauts, A. De Geyter, T. Bearda Electrochemical Society	10 国際会議録 Short Time Force Measurement System Mertens, J., KOnig, K. ESA Publications Division
5 国際会議録 Particle Removal from Micrometer-Sized Trenches Using High-Velocity-Aerosol Cleaning and Comparison with Megasonic Tank Cleaning K.L. Wostyn, K. Sano, A. Eitoku, T. Janssens, T. Bearda Electrochemical Society	11 国際会議録 Characteristics and prevention of pattern collapse in EUV lithography W. Chang, E. Kim, Y. Kang, S. Park, C. Lim, K. Won, J. Kim, H. Oh SPIE - The International Society of Optical Engineering
6 国際会議録 Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal Hong, Y.K., Eom, D.H., Lee, S.H., Park, J.G., Busnaina, A.A. Electrochemical Society	12 国際会議録 Simulation of complex resist pattern collapse with mechanical modeling Lee, H.-J., Park, J.-T., Kwon, Y.-K., Oh, H.-K. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12