Particle Removal from Micrometer-Sized Trenches Using High-Velocity-Aerosol Cleaning and Comparison with Megasonic Tank Cleaning

Particle Removal from Micrometer-Sized Trenches Using High-Velocity-Aerosol Cleaning and Comparison with Megasonic Tank Cleaning

著者名:

掲載資料名:

Cleaning and surface conditioning technology in semiconductor device manufacturing 10

シリーズ名:

ECS transactions

シリーズ巻号:

11(2)

発行年:

2007

開始ページ:

55

終了ページ:

60

総ページ数:

6

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775687 [156677568X]

言語:

英語

請求記号:

E23400/11-2

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013286
シリーズID:	PA00000034
会議名:	ECS Meeting
回次:	212th
会議開催地:	Washington, DC, USA
会議開催年:	2007.10.07-2007.10.12
論文注記:	212th ECS Meeting, October 7 - October 12, 2007, Washington, DC

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4 国際会議録 SINGLE - WAFER WET CLEANING FOR A HIGH PARTICLE REMOVAL EFFICIENCY ON HYDROPHOBIC SURFACE K. Sano, A. Izumi, A. Eitoku, J. Snow, E. Kesters, P. Mertens Electrochemical Society	10 国際会議録 IMPROVED DEFECTIVITY FOR BEOL CLEANS USING SINGLE WAFER MEGASONICS L. Y. Lee, T. Thanigaivelan, J. So, B. Frasier, I. Kashkoush Electrochemical Society
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