The Effect of Process Parameters on CVD Cu Seed Layer Deposition on Ru and Ta Under-layer

The Effect of Process Parameters on CVD Cu Seed Layer Deposition on Ru and Ta Under-layer

著者名:

掲載資料名:

Fundamental Gas-Phase and Surface Chemistry of Vapor-Phase Materials Processing 3

シリーズ名:

ECS transactions

シリーズ巻号:

2(7)

発行年:

2007

開始ページ:

157

終了ページ:

165

総ページ数:

9

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775182 [1566775183]

言語:

英語

請求記号:

E23400/2-7 [7]

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00046580
シリーズID:	PA00000034
会議名:	ECS Meeting
回次:	209th
会議開催地:	Denver, Colorado, USA
会議開催年:	2006.05.07-2006.05.12
論文注記:	209th ECS Meeting, May 7-May 12, 2006, Denver, Colorado

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