Manufacturing and Microstructure of Cu Coated Diamonds/SnAgCu Composite Solder Bumps

Manufacturing and Microstructure of Cu Coated Diamonds/SnAgCu Composite Solder Bumps

著者名:

掲載資料名:

Advanced mechanical engineering III : selected, peer reviewed papers from the 2013 International Conference on Advanced Mechanical Engineering (AME 2013), Wuhan, China, 2-3 February 2013

シリーズ名:

Applied mechanics and materials

シリーズ巻号:

288

発行年:

2013

開始ページ:

323

終了ページ:

327

総ページ数:

5

出版情報:

Stafa-Zuerich: Trans Tech Publications

ISSN:

16609336

ISBN:

9781627480567 [1627480560]

言語:

英語

請求記号:

A69500/288

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00053045
シリーズID:	PA00000242
会議名:	International Conference on Advanced Mechanical Engineering (AME)
回次:	2013
会議開催地:	Wuhan, China
会議開催年:	2013.02.02-2013002.03
論文注記:	2013 International Conference on Advanced Mechanical Engineering (AME), Wuhan, China, 2-3 February 2013

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