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Analysis on the Drop of PCB Packaged by Cushion Material Based on Finite Element Method

著者名:
掲載資料名:
Advanced mechanical engineering III : selected, peer reviewed papers from the 2013 International Conference on Advanced Mechanical Engineering (AME 2013), Wuhan, China, 2-3 February 2013
シリーズ名:
Applied mechanics and materials
シリーズ巻号:
288
発行年:
2013
開始ページ:
303
終了ページ:
307
総ページ数:
5
出版情報:
Stafa-Zuerich: Trans Tech Publications
ISSN:
16609336
ISBN:
9781627480567 [1627480560]
言語:
英語
請求記号:
A69500/288
資料種別:
国際会議録

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