Development of materials and processes for double patterning toward 32-nm node 193-nm immersion lithography process

Development of materials and processes for double patterning toward 32-nm node 193-nm immersion lithography process

著者名:

S. Tarutani ( FUJIFILM Corp., Japan )
H. Tsubaki ( FUJIFILM Corp., Japan )
S. Kanno ( FUJIFILM Corp., Japan )

掲載資料名:

Advances in resist materials and processing technology XXV

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

6923

発行年:

2008

巻:

1

開始ページ:

69230F-1

終了ページ:

69230F-8

総ページ数:

8

出版情報:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819471086 [0819471089]

言語:

英語

請求記号:

P63600/6923

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00052554
シリーズID:	PA00000029
会議名:	SPIE Advanced Lithography : Advances in Resist Materials and Processing Technology
回次:	2008 : 25th
会議開催地:	San Jose, California, USA
会議開催年:	2008.02.25-2008.02.27
論文注記:	Advances in resist materials and processing technology XXV, 25-27 February 2008, San Jose, California, USA. Session 4. Materials and Processes for Double Patterning/Double Exposure, 69230F, 6923-14

類似資料:

1 国際会議録 Patterning performance of hyper NA immersion lithography for 32nm node logic process K. Takahata, M. Kajiwara, Y. Kitamura, T. Ojima, M. Satake Society of Photo-optical Instrumentation Engineers	7 国際会議録 45nm and 32nm half-pitch patterning with 193nm dry lithography and double patterning H. Dai, C. Bencher, Y. Chen, H. Woo, C. Ngai Society of Photo-optical Instrumentation Engineers
2 国際会議録 Behavior and effects of water penetration in 193-nm immersion lithography process materials T. Niwa, S. Scheer, M. Carcasi, M. Enomoto, T. Tomita, K. Hontake, H. Kyoda, J. Kitano SPIE - The International Society of Optical Engineering	8 国際会議録 32 nm logic patterning options with immersion lithography K. Lai, S. Burns, S. Halle, L. Zhuang, M. Colburn Society of Photo-optical Instrumentation Engineers
3 国際会議録 32nm node technology development using interference immersion lithography Wu, T. H., Lin, L. C., Lin, C. L. SPIE - The International Society of Optical Engineering	9 国際会議録 Simulation of the 45-nm half-pitch node with 193-nm immersion lithography Biswas, A.M., Frauenglass, A., Brueck, S.R.J. SPIE - The International Society of Optical Engineering
4 国際会議録 Reflection control for immersion lithography at 45/32-nm nodes W.-J. Tseng, R.-H. Hsu, S. H. Hou, T.-H. Tseng, B. Lin Society of Photo-optical Instrumentation Engineers	10 国際会議録 25 nm immersion lithography at 193 nm wavelength Choi, S.-H., Park, T.-H., Kim, E., Youn, H.-J., Lee, D.-Y., Ban, Y.-C., Je, A.-Y., Kim, D.-H., Hong, J.-S., Kim, Y.-H., … SPIE - The International Society of Optical Engineering
5 国際会議録 Synthesis of fluorinated materials for 193-nm immersion lithography and 157-nm lithography Lee, C. H., Han, S., Park, K. S., Kang, H. Y., Oh, H. W., Lee, J. E., Kim, K. M., Kim, Y. H., Kim, T. S., Oh, H.-K. SPIE - The International Society of Optical Engineering	11 国際会議録 High-index materials for 193 nm immersion lithography John H. Burnett, Simon G. Kaplan, Eric L. Shirley, Paul J. Tompkins, James E. Webb SPIE - The International Society of Optical Engineering
6 国際会議録 Extending immersion lithography to the 32-nm node S. Warrick, W. Conley, V. Farys, M. Benndorf, J. Gemmink, Y. Trouiller, J. Belledent, D. Jovanovic, P. Gouraud SPIE - The International Society of Optical Engineering	12 国際会議録 Spin-on trilayer scheme: enabling materials for extension of ArF immersion lithography to 32nm node and beyond R. Zhang, A. G. Timko, L. Pylneva, J. Loch, H. Wu Society of Photo-optical Instrumentation Engineers

1

2

3

4

5

6

7

8

9

10

11

12