3D mask modeling with oblique incidence and mask corner rounding effects for the 32nm node
- 著者名:
- M. Saied ( Freescale Semiconductor, France )
- F. Foussadier ( STMicroelectronics, France )
- J. Belledent ( NXP Semiconductors, France )
- Y. Trouiller ( CEA/LETI, France )
- I. Schanen ( IMEP, France )
- 掲載資料名:
- Photomask technology 2007
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 6730
- 発行年:
- 2007
- 巻:
- 3
- 開始ページ:
- 673050-1
- 終了ページ:
- 673050-11
- 総ページ数:
- 11
- 出版情報:
- Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers
- ISSN:
- 0277786X
- ISBN:
- 9780819468871 [0819468878]
- 言語:
- 英語
- 請求記号:
- P63600/6730
- 資料種別:
- 国際会議録
類似資料:
SPIE - The International Society of Optical Engineering |
7
国際会議録
Process window OPC verification: dry versus immersion lithography for the 65 nm node [6154-169]
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
12
国際会議録
Improving model-based OPC performance for the 65-nm node through calibration set optimization
SPIE - The International Society of Optical Engineering |