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Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking

著者名:
掲載資料名:
Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
1112
発行年:
2009
開始ページ:
121
終了ページ:
132
総ページ数:
12
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781605110844 [1605110841]
言語:
英語
請求記号:
M23500/1112
資料種別:
国際会議録

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