Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking
- 著者名:
- 掲載資料名:
- Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 1112
- 発行年:
- 2009
- 開始ページ:
- 121
- 終了ページ:
- 132
- 総ページ数:
- 12
- 出版情報:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781605110844 [1605110841]
- 言語:
- 英語
- 請求記号:
- M23500/1112
- 資料種別:
- 国際会議録
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