Current and Future 3D-LSI Technology for the Image Sensor Devices

Current and Future 3D-LSI Technology for the Image Sensor Devices

著者名:

掲載資料名:

Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

1112

発行年:

2009

開始ページ:

25

終了ページ:

32

総ページ数:

8

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781605110844 [1605110841]

言語:

英語

請求記号:

M23500/1112

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00049453
シリーズID:	PA00000011
会議名:	MRS Fall Meeting
回次:	2008
会議開催地:	Boston, Massachusetts, USA
会議開催年:	2008.12.01-2008.12.03

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