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A Study of Interfacial Layer Effect Synthesized by High Energy Ion Cascade on Adhesion Strength Deterioration Between Copper Thin Film and Polyimide Substrates

著者名:
  • Y.M. Chung ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
  • W.S. Jung ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
  • C.S. Moon ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
  • J.G. Han ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
掲載資料名:
48th annual technical conference proceedings, April 23-28, 2005, Denver, Colorado
シリーズ名:
Annual Technical Conference of Society of Vacuum Coaters
シリーズ巻号:
48
発行年:
2005
開始ページ:
739
終了ページ:
744
総ページ数:
6
出版情報:
Albuquerque, NM: Society of Vacuum Coaters
ISSN:
07375921
言語:
英語
請求記号:
A63930/48
資料種別:
国際会議録

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