An Information-Driven FEA Model Generation Approach for Chip Package Applications

An Information-Driven FEA Model Generation Approach for Chip Package Applications

著者名:

Sai Zeng

掲載資料名:

23rd Computers and Information in Engineering Conference, Parts A and B; Volume 1

シリーズ名:

ASME Symposia Volumes

シリーズ巻号:

DETC 2003(1A)

発行年:

2003

巻:

1A

ペーパー番号:

DETC2003/CIE-48209

開始ページ:

363

終了ページ:

370

総ページ数:

8

出版情報:

New York, N.Y.: American Society of Mechanical Engineers

ISBN:

9780791836996 [0791836991]

言語:

英語

請求記号:

A11633/2003

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00048576
シリーズID:	PA00000270
会議名:	ASME Design Engineering Technical Conferences ; Computers and Information in Engineering Conference
回次:	2003 ; 23rd
会議開催地:	Chicago, IL, USA
会議開催年:	2003.09.02-2003.09.06

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