An Easy Method to Measure the Damaged Thickness of Low-k Film after Ash Process
- 著者名:
C. Shim H. Lim S. Jung I. Shin K. Park J. Whang H. Lee J. Kim J. Han K. Kim - 掲載資料名:
- Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing
- シリーズ名:
- ECS transactions
- シリーズ巻号:
- 2(1)
- 発行年:
- 2006
- 開始ページ:
- 243
- 終了ページ:
- 254
- 総ページ数:
- 12
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566774383 [1566774381]
- 言語:
- 英語
- 請求記号:
- E23400/2-1
- 資料種別:
- 国際会議録
類似資料:
SPIE - The International Society of Optical Engineering |
Trans Tech Publications |
Trans Tech Publications |
8
国際会議録
Enhancement of Adhesion Between Cu Thin Film and Polyimide Modified by Ion Assisted Reaction
MRS - Materials Research Society |
Materials Research Society |
SPIE-The International Society for Optical Engineering |
10
国際会議録
XPS AND FTIR STUDY OF THE THIN POLYIMIDE FILMS FABRICATED BY IONIZED CLUSTER BEAM DEPOSITION
Materials Research Society | |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |