Copper Diffusion and Corrosion Behavior Through the Hillock Defect Found Beneath the Weak SiN Dielectric Barrier in Dual Damascene Process
- 著者名:
S. Kim C. Shim J. Hong H. Lee J. Han K. Kim Y. Kim - 掲載資料名:
- Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing
- シリーズ名:
- ECS transactions
- シリーズ巻号:
- 2(1)
- 発行年:
- 2006
- 開始ページ:
- 237
- 終了ページ:
- 242
- 総ページ数:
- 6
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566774383 [1566774381]
- 言語:
- 英語
- 請求記号:
- E23400/2-1
- 資料種別:
- 国際会議録
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