Development of Electrochemical Mechanical Polishing for Advanced Copper Planarization

Development of Electrochemical Mechanical Polishing for Advanced Copper Planarization

著者名:

R. Jia

掲載資料名:

Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA

シリーズ名:

ECS transactions

シリーズ巻号:

1(11)

発行年:

2006

開始ページ:

125

終了ページ:

134

総ページ数:

10

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566774994 [1566774993]

言語:

英語

請求記号:

E23400/1-11

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00047105
シリーズID:	PA00000034
会議名:	ECS meeting
回次:	208th
会議開催地:	Los Angeles, California, USA
会議開催年:	2005.10.16-2005.10.21

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