THE EFFECTS OF pH ADJUSTORS IN POST Cu CMP CLEANING SOLUTIONS ON PARTICLE ADHESION AND REMOVAL | 東京工業大学附属図書館文献データベース

Blank Cover Image

THE EFFECTS OF pH ADJUSTORS IN POST Cu CMP CLEANING SOLUTIONS ON PARTICLE ADHESION AND REMOVAL

著者名:

さらに 5 件

掲載資料名:

Cleaning Technology in Semiconductor Device Manufacturing IX

シリーズ名:

ECS transactions

シリーズ巻号:

1(3)

発行年:

2006

開始ページ:

333

終了ページ:

340

総ページ数:

8

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566774291 [1566774292]

言語:

英語

請求記号:

E23400/1-3

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00047097
シリーズID:	PA00000034
会議名:	International Symposium on Cleaning Technology in Semiconductor Device Manufacturing ; Fall Meeting of the Electrochemical Society
回次:	9th ; 2005
会議開催地:	Los Angeles, California, USA
会議開催年:	2005.10.00

類似資料:

1 国際会議録 Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal Hong, Y.K., Eom, D.H., Lee, S.H., Park, J.G., Busnaina, A.A. Electrochemical Society	7 国際会議録 The Adsorption Behaviors of Citric Acid on Abrasive Particles in Cu CMP Slurry Kang, Young-Jae, Hong, Yi-Koan, Song, Jae-Hoon, Kim, In-Kwon, Park, Jin-Goo Materials Research Society
2 国際会議録 NEW APPROACH FOR STUDY OF PARTICLE ADHESION AND REMOVAL RELEVANT TO POST CMP CLEANING Lee, S.-Y., Lee, S.-H., Eom, D.-H., Kim, K.-S., Song, H.-S., Park, J.-G. Electrochemical Society	8 国際会議録 EFFECT OF H2O2 AND IPA ADDITION IN DILUTE HF SOLUTION ON SURFACE ETCHING AND PARTICLE REMOVAL EFFICIENCY Eom, D.-H., Lee, S.-H., Kim, K.-S., Lee, C.-H., Park, J.-G. Electrochemical Society
3 国際会議録 EFFECT OF CORROSION INHIBITOR, lH-BENZOTRJAZOLE (BTAH) ON PARTICLE ADHESION IN Cu CMP J.-H. Song, Y.-K. Hong, T.-G. Kim, Y.-J. Kang, I.-K. Kim, J.-H. Han, J.-G. Park, A. A. Busnaina Electrochemical Society	9 国際会議録 Mechanisms of Post-CMP Cleaning Liang, H., Estragnat, E., Lee, J., Bahten, K., McMullen, D. Materials Research Society
4 国際会議録 Passivation and Etching Behaviors of Copper Surface in Copper CMP Slurries Eom, D.-H., Hong, Y.-K., Lee, S.-H., Park, J.-Y., Myung, J.-J., Park, J.-G., Kim, K.-S., Song, H.-S., Park, H.-S., Choi, … Electrochemical Society	10 国際会議録 ADHESION AND REMOVAL OF SILICA AND ALUMINA SLURRY PARTICLES DURING Cu CMP PROCESS Park, J., Busnaina, A.A. Electrochemical Society
5 国際会議録 Electrochemical and Frictional Behaviors of Cu Surface in Organic Acid Based Slurries During Copper CMP Eom, D.-H., Ryu, J.-S., Hong, Y.-K., Myung, J.-J., Kim, K.-S., Park, J.-G. Electrochemical Society	11 国際会議録 Frictional Behavior and Particle Adhesion of Abrasive Particles during Cu CMP Hong, Yi-Koan, Han, Ja-Hyung, Song, Jae-Hoon, Park, Jin-Goo Materials Research Society
6 国際会議録 The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP Song, Jae-Hoon, Han, Ja-Hyung, Hong, Yi-Koan, Kang, Young-Jae, Park, Jin-Goo, Maeng, Ju-Ho, Won, Young-Man Materials Research Society	12 国際会議録 The Effect of Additives in Cu CMP Slurry on Cu Polishing Hong, Y.-K., Eom, D.-H., Park, J.-G. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12