Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications using RELACS shrink and corresponding OPC

Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications using RELACS shrink and corresponding OPC

著者名:

M. O. de Beeck ( IMEC (Belgium) )

J. Versluijs ( IMEC (Belgium) )

V. Wiaux ( IMEC (Belgium) )

T. Vandeweyer ( IMEC (Belgium) )

I. Ciofi ( IMEC (Belgium) )

H. Struyf ( IMEC (Belgium) )

D. Hendrickx ( IMEC (Belgium) )

J. V. Olmen ( IMEC (Belgium) )

さらに 3 件

掲載資料名:

Optical microlithography XX

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

6520

発行年:

2007

出版情報:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819466396 [0819466395]

言語:

英語

請求記号:

P63600/6520

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00046827
シリーズID:	PA00000029
会議名:	SPIE Advanced Lithography : Optical Microlithography
回次:	2007 : 20th
会議開催地:	San Jose, CA, USA
会議開催年:	2007.02.27-2007.03.02

類似資料:

1 国際会議録 30nm half-pitch metal patterning using Moti CD shrink technique and double patterning J. Versluijs, J.-F. De Marneffe, D. Goossens, M. Op de Beeck, T. Vandeweyer Society of Photo-optical Instrumentation Engineers	7 国際会議録 Double patterning design split implementation and validation for the 32nm node M. Drapeau, V. Wiaux, E. Hendrickx, S. Verhaegen, T. Machida SPIE - The International Society of Optical Engineering
2 国際会議録 Double patterning scheme for sub-0.25 k1 single damascene structures at NA=0.75, λ-193nm Maenhoudt, M., Versluijs, J., Struyf, H., Olmen, J. Van, Hove, M. Van SPIE - The International Society of Optical Engineering	8 国際会議録 Early learning on hyper-NA lithography using two-beam immersion interference [6154-70] Hendrickx, E., Op de Beeck, M., Gronheid, R., Versluijs, J., Van Look, L., Ercken, M., Vandenberghe, G. SPIE - The International Society of Optical Engineering
3 国際会議録 Double pattern EDA solutions for 32nm HP and beyond G. E. Bailey, A. Tritchkov, J. Park, L. Hong, V. Wiaux, E. Hendrickx, S. Verhaegen, P. Xie, J. Versluijs SPIE - The International Society of Optical Engineering	9 国際会議録 60nm half pitch contact layer printing: exploring the limits at 1.35NA lithography J. Bekaert, E. Hendrickx, G. Vandenberghe Society of Photo-optical Instrumentation Engineers
4 国際会議録 Lithography options for the 32nm half pitch node and their implications on resist and material technology Q. Gronheid, E. Hendrickx, V. Wiaux, M. Maenhoudt, M. Goethals Society of Photo-optical Instrumentation Engineers	10 国際会議録 Patterning 220-nm pitch DRAM patterns by using double mask exposure Nam,D., Seong,N., Cho,H., Moon,J., Lee,S. SPIE - The International Society for Optical Engineering
5 国際会議録 A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond M. O. de Beeck, J. Versluijs, Z. Tokei, S. Demuynck, J. D. Marneffe, W. Boullart, S. Vanhaelemeersch, H. Zhu, P. … SPIE - The International Society of Optical Engineering	11 国際会議録 Inspection results for 32nm logic and sub-50nm half-pitch memory reticles using the TeraScanHR J.-P. Sier, W. Broadbent, F. Mirzaagha, P. Yu Society of Photo-optical Instrumentation Engineers
6 国際会議録 Application challenges with double patterning technology (DPT) beyond 45 nm [6349-75] Park, J., Hsu, S., Van Den Broeke, D., Chen, J. F., Dusa, M., Socha, R., Finders, J., Vleeming, B., van Oosten, A., … SPIE - The International Society of Optical Engineering	12 国際会議録 32nm half pitch node OPC process model development for three dimensional mask effects using rigorous simulation L. S. Melvin III, T. Schmoeller, J. Li Society of Photo-optical Instrumentation Engineers

1

2

3

4

5

6

7

8

9

10

11

12