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A Study of Tungsten-Titanium Barriers in Silver Metallization

著者名:
掲載資料名:
Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics : symposium held April 10-12, 2007, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
990
発行年:
2007
開始ページ:
153
終了ページ:
158
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558999503 [1558999507]
言語:
英語
請求記号:
M23500/990
資料種別:
国際会議録

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