Materials Aspects to Consider in the Fabrication of Through-Silicon Vias
- 著者名:
S. Burkett L. Schaper T. Rowbotham J. Patel T. Lam I.U. Abhulimen D.D. Boyt M. Gordon L. Cai - 掲載資料名:
- Enabling technologies for 3-D integration : symposium held November 27-29, 2006, Boston, Massachusetts, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 970
- 発行年:
- 2007
- 開始ページ:
- 261
- 終了ページ:
- 274
- 総ページ数:
- 14
- 出版情報:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558999275 [1558999272]
- 言語:
- 英語
- 請求記号:
- M23500/970
- 資料種別:
- 国際会議録
類似資料:
Society of Vacuum Coaters |
SPIE - The International Society for Optical Engineering |
Electrochemical Society |
8
国際会議録
Fabrication and characterisation of Silicon On Insulator substrates incorporating thermal vias.
Kluwer Academic Publishers |
MRS - Materials Research Society |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
Materials Research Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |