Fabrication and Evaluation of 3-D Packages With Through Hole Via

Fabrication and Evaluation of 3-D Packages With Through Hole Via

著者名:

Dong Min Jang

掲載資料名:

Enabling technologies for 3-D integration : symposium held November 27-29, 2006, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

970

発行年:

2007

開始ページ:

171

終了ページ:

178

総ページ数:

8

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558999275 [1558999272]

言語:

英語

請求記号:

M23500/970

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00046625
シリーズID:	PA00000011
会議名:	MRS Fall Meeting : Symposium Y
回次:	2006
会議開催地:	Boston, Massachusetts, USA
会議開催年:	2006.11.27-2006.11.29

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