Blank Cover Image

Deformation and Heat Treatment of Cold Drawn Gold

著者名:
S.H. Kang
J.H. Cho
J.S. Hwang
J.S. Cho
Y.J. Park
J.T. Moon
K.H. Oh
さらに 2 件
掲載資料名:
Fundamentals of deformation and annealing : proceedings of the International Symposium held to coincide with the retirement of Professor John Humphreys in Manchester, UK, 5th-7th September 2006
シリーズ名:
Materials science forum
シリーズ巻号:
550
発行年:
2007
開始ページ:
289
終了ページ:
294
総ページ数:
6
出版情報:
Uetikon-Zuerich, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494347 [0878494340]
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

類似資料:

1 国際会議録 Characterization of Cold Drawn Gold bonding Wire with EBSD

Cho, J.-H., Cho, J.S., Moon, J.T., Lee, J., Cho, Y.H., Rollett, A.D., Oh, K.H.

Trans Tech Publications
7 国際会議録 Microstructure and Texture Analysis in Twin-Roll Strip Cast Fe-36wt%Ni Alloy

Park, J.Y., Choi, J.T., Kang, T., Oh, K.H., Szpunar, J.A.

Trans Tech Publications
2 国際会議録 Deformation Texture of Cold Drawn Al6063 Tube

Cho, J.-H., Park, S.-J., Choi, S.-H., Oh, K.H.

Trans Tech Publications
8 国際会議録 In Situ Deformation Behavior of Retained Austenite in TRIP Steel

Park, K.K., Oh, S.T., Baeck, S.M., Kim, D.-I., Han, J.H., Han, H.N., Park, S.-H., Lee, C.G., Kim, S.-J., Oh, K.H.

Trans Tech Publications
3 国際会議録 High Tensile Strength of Drawn Gold

Kang, S. H., Jung, H. S., Bang, W. H., Cho, J. H., Oh, K. H., Kim, D. S., Cho, J. S., Park, Y. J.

Trans Tech Publications
9 国際会議録 Effect of Prior Strain on Damping Capacity and Mechanical Property during Heat Treatment

J.H. Kwak, C.Y. Kang, H.S. Kwon, K.H. Kim

Trans Tech Publications
4 国際会議録 Texture and Microstructure Evolution of Gold Sheet during Deformation and Annealing

J.H. Cho, S.H. Choi, K.H. Oh

Trans Tech Publications
10 国際会議録 Effect of Prior Strain on Damping Capacity and Mechanical Property during Heat Treatment

J.H. Kwak, C.Y. Kang, H.S. Kwon, K.H. Kim

Trans Tech Publications
5 国際会議録 Texture Analysis of Copper Bonding Wire

Baeck, S.M., Park, K.K., Ha, H., Oh, Y., Park, Y., Moon, J.T., Lee, J., Oh, K.H.

Trans Tech Publications
11 国際会議録 The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing

J.H. Cho, A.D. Rollett, K.H. Oh

Trans Tech Publications
6 国際会議録 Application of Platinum and Titanium Materials as an Electrode for Hygiene Purpose

B.S. Oh, S.Y. Park, Y.J. Jung, K.W. Baek, T.M. Hwang, K.S. Cho, J.W. Kang

Trans Tech Publications
12 国際会議録 Design and evaluation of automatic joining-assembly system of optical collimators with high efficiency

Choi, D.S., Je, T.J., Hwang, K.H., Moon, J.H.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12