Blank Cover Image

Estimation of Micro-Formability and FEM Simulation of Micro-Forming Process of a Zr-Based Bulk Metallic Glass

著者名:
掲載資料名:
THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canada
シリーズ名:
Materials science forum
シリーズ巻号:
539-543(2)
発行年:
2007
巻:
539-543
開始ページ:
2129
終了ページ:
2136
総ページ数:
8
出版情報:
Stafa-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494286 [0878494286]
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

類似資料:

1 国際会議録 Quasicrystal Formation in a Zr-Based Bulk Metallic Glass

Liu, L., Chan, K.C., Pang, G.K.H.

Materials Research Society
7 国際会議録 Nd:Glass Laser with a Phase Conjugating Mirror Based on SBS,

Kim,H.S., Um,K.Y., Park,J.R., Shin,Y.S., Lee,J.Y., Byun,J.O., Han,K.H., Park,H.S., Kong,H.J

SPIE-The International Society for Optical Engineering
2 国際会議録 Quasicrystal Formation in a Zr-Based Bulk Metallic Glass

Liu, L., Chan, K.C., Pang, G.K.H.

Materials Research Society
8 国際会議録 In-situ laser deposition of superconducting thin films on metallic substrate

Jeong,Y.S., Park,J.H., Lee,S.Y.

SPIE-The International Society for Optical Engineering
3 国際会議録 Ti-Based Bulk Metallic Glass with High Cold Workability at Room Temperature

Park, J. M., Park, J. S., Kim, J. H., Lee, M. H., Kim W, T., Kim D, H.

Trans Tech Publications
9 国際会議録 Glass Forming Ability and Thermal Properties of a Cu-Based Bulk Metallic Glass Microalloyed with Silicon

J.S.C. Jang, Y.C. Huang, C.H. Lee, I.S. Lee, L.J. Chang

Trans Tech Publications
4 国際会議録 Integration of polymer-based optical waveguide arrays and micro/nano-photonic devices for optical printed circuit board (O-PCB) application (Invited Paper)

Lee, E.-H., Lee, S.G., Park, B.H.O.S.-G., Kim, K.H., Kang, J.K., Choi, Y.W.

SPIE - The International Society of Optical Engineering
10 国際会議録 Consolidation of Bulk Metallic Glass Composites

J.K. Lee, H.J. Kim, T.S. Kim, S.Y. Shin, J.C. Bae

Trans Tech Publications
5 国際会議録 New Cu-Based Bulk Metallic Glasses with High Strength of 2000 MPa

Shin, S.Y., Kim, J.H., Lee, D.M., Lee, J.K., Kim, H.J., Jeong, H.G., Bae, J.C.

Trans Tech Publications
11 国際会議録 Simulation based post OPC verification to enhance process window critical failure analysis and yield [6154-137]

Kang, J. H., Chol, J. Y., Yun, K.H., Do, M., Lee, Y.S., Kim, K.

SPIE - The International Society of Optical Engineering
6 国際会議録 Analysis on the Phase Transition Behavior of Bulk Metallic Glass by Electrical Resistivity Measurement

K.T. Hong, Y.S. Ji, S.J. Chung, M.R. Ok, Y.H. Ji, K.S. Lee

Trans Tech Publications
12 国際会議録 Development of Miniaturized Micro Metal Forming Manufacturing System

H.J. Lee, N.K. Lee, S.G. Choi

Trans Tech Publications
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12