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Modeling of Back Pressure Distribution on the Wafer Loaded in a Multi-Zone Carrier in Chemical Mechanical Polishing

著者名:
掲載資料名:
Advances in materials manufacturing science and technology II : selected papers from the 12th International Manufacturing Conference in China, September 21-23, 2006, Xi'an, China
シリーズ名:
Materials science forum
シリーズ巻号:
532-533
発行年:
2006
開始ページ:
233
終了ページ:
236
総ページ数:
4
出版情報:
Uetikon-Zuerich, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494217 [0878494219]
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

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