Process results using automatic pitch decomposition and double patterning technology (DPT) at k1eff

Process results using automatic pitch decomposition and double patterning technology (DPT) at k1eff <0.20 [6349-36]

著者名:

Huckabay, J.

Staud, W.

Naber, R. ( Cadence Design Systems, Inc. (USA) )

van Oosten, A. ( ASML, Inc. (Netherlands) )

Flagello, D. ( ASML, Inc. (USA) )

さらに 4 件

掲載資料名:

Photomask Technology 2006

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

6349

発行年:

2006

パート:

1

開始ページ:

634910

終了ページ:

634911

総ページ数:

2

出版情報:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819464446 [0819464449]

言語:

英語

請求記号:

P63600/6349

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00016353
シリーズID:	PA00000029
会議名:	SPIE Photomask Technology : Annual BACUS Symposium on Photomask Technology
回次:	2006 : 26th
会議開催地:	Monterey, CA, USA
会議開催年:	2006.09.19-2006.09.22

類似資料:

1 国際会議録 Automatic pitch decomposition for improved process window when printing dense features at keff<0.20 [6283-102] Huckabay, J., Staud, W., Naber, R., Dusa, M., Flagello, D., Socha, R. SPIE - The International Society of Optical Engineering	7 国際会議録 Near-0.3 k1 full pitch range contact hole patterning using chromeless phase lithography (CPL) Van Den Broeke, D.J., Socha, R., Hsu, S.D., Chen, J.F., Laidig, T.L., Corcoran, N., Hollerbach, U., Wampler, K.E., Shi, … SPIE - The International Society of Optical Engineering
2 国際会議録 Application challenges with double patterning technology (DPT) beyond 45 nm [6349-75] Park, J., Hsu, S., Van Den Broeke, D., Chen, J. F., Dusa, M., Socha, R., Finders, J., Vleeming, B., van Oosten, A., … SPIE - The International Society of Optical Engineering	8 国際会議録 Forbidden pitches for 130-nm lithography and below Socha,R.J., Dusa,M.V., Capodieci,L., Finders,J., Chen,J.F., Flagello,D.G., Cummings,K.D. SPIE - The International Society for Optical Engineering
3 国際会議録 Pattern split rules! A feasibility study of rule based pitch decomposition for double patterning A. van Oosten, P. Nikolsky, J. Huckabay, R. Goossens, R. Naber Society of Photo-optical Instrumentation Engineers	9 国際会議録 Understanding the forbidden pitch phenomenon and assist feature placement Shi, X., Hsu, S., Chen, J.F., Hsu, M., Socha, R.J., Dusa, M.V. SPIE-The International Society for Optical Engineering
4 国際会議録 Full-chip pitch/pattern splitting for lithography and spacer double patterning technologies T.-B. Chiou, R. Socha, H.-Y. Kang, A. C. Chen, S. Hsu Society of Photo-optical Instrumentation Engineers	10 国際会議録 Development of layout split algorithms and printability evaluation for double patterning technology T.-B. Chiou, R. Socha, H. Chen, L. Chen, S. Hsu Society of Photo-optical Instrumentation Engineers
5 国際会議録 Litho-aware extraction for the 32nm double patterning node J. Huckabay, Q. Chen, C. Thayer, R. Naber Society of Photo-optical Instrumentation Engineers	11 国際会議録 Through-pitch low-k1 contact hole imaging with CPL technology Wiaux, V., Bekaert, J., Chen, J.F., Hsu, S.D., Ronse, K.G., Socha, R.J., Vandenberghe, G., Van Den Broeke, D.J. SPIE - The International Society of Optical Engineering
6 国際会議録 Understanding the forbidden pitch and assist feature placement Shi,X., Hsu,S., Chen,F., Hsu,M., Socha,R.J., Dusa,M.V. SPIE-The International Society for Optical Engineering	12 国際会議録 Double patterning technology: process-window analysis in a many-dimensional space A. Sezginer, B. Yenikaya, W. Staud SPIE - The International Society of Optical Engineering

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