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Simulation based post OPC verification to enhance process window critical failure analysis and yield [6154-137]

著者名:
Kang, J. H. ( DongbuAnam Semiconductor (South Korea) )
Chol, J. Y. ( DongbuAnam Semiconductor (South Korea) )
Yun, K.H. ( DongbuAnam Semiconductor (South Korea) )
Do, M. ( DongbuAnam Semiconductor (South Korea) )
Lee, Y.S. ( DongbuAnam Semiconductor (South Korea) )
Kim, K. ( DongbuAnam Semiconductor (South Korea) )
さらに 1 件
掲載資料名:
Optical Microlithography XIX
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
6154
発行年:
2006
パート:
3
開始ページ:
61543J
出版情報:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461971 [0819461970]
言語:
英語
請求記号:
P63600/6154
資料種別:
国際会議録

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