Simulation based post OPC verification to enhance process window critical failure analysis and yield [6154-137]
- 著者名:
Kang, J. H. ( DongbuAnam Semiconductor (South Korea) ) Chol, J. Y. ( DongbuAnam Semiconductor (South Korea) ) Yun, K.H. ( DongbuAnam Semiconductor (South Korea) ) Do, M. ( DongbuAnam Semiconductor (South Korea) ) Lee, Y.S. ( DongbuAnam Semiconductor (South Korea) ) Kim, K. ( DongbuAnam Semiconductor (South Korea) ) - 掲載資料名:
- Optical Microlithography XIX
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 6154
- 発行年:
- 2006
- パート:
- 3
- 開始ページ:
- 61543J
- 出版情報:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819461971 [0819461970]
- 言語:
- 英語
- 請求記号:
- P63600/6154
- 資料種別:
- 国際会議録
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Process window OPC verification: dry versus immersion lithography for the 65 nm node [6154-169]
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