A lamp thermoelectricity based integrated bake/chill system for advanced photoresist processing [6153-175]
- 著者名:
- Tay, A. ( National Univ. of Singapore (Singapore) )
- Chua, H.-I. ( Univ. of Western Australia (Australia) )
- Wu, X. ( National Univ. of Singapore (Singapore) )
- Wang, Y. ( National Univ. of Singapore (Singapore) )
- 掲載資料名:
- Advances in Resist Technology and Processing XXIII
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 6153
- 発行年:
- 2006
- パート:
- 2
- 開始ページ:
- 61534M
- 出版情報:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819461964 [0819461962]
- 言語:
- 英語
- 請求記号:
- P63600/6153
- 資料種別:
- 国際会議録
類似資料:
SPIE - The International Society of Optical Engineering |
American Institute of Chemical Engineers |
Society of Photo-optical Instrumentation Engineers |
SPIE - The International Society of Optical Engineering |
3
国際会議録
Influence of wafer warpage on photoresist film thickness and extinction coefficient measurements
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |