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Evaluation of Deformation Behavior in Cu Thin Film under Tensile and Fatigue Loading by X-Ray Method

著者名:
掲載資料名:
Residual stresses VII : ECRS 7 : proceedings of the 7th European conference on residual stresses, Berlin, Germany, 13-15 September 2006
シリーズ名:
Materials science forum
シリーズ巻号:
524-525
発行年:
2006
開始ページ:
807
終了ページ:
812
総ページ数:
6
出版情報:
Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878494149 [0878494146]
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

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