INTEGRATED, DUAL-FUNCTION REMOTE PLASMA-ENHANCED PROCESSING APPLIED TO LOW DAMAGE SiO2 ETCHING AND REMOVAL OF C-F POLYMER RESIDUES
- 著者名:
- 掲載資料名:
- Chemical perspectives of microelectric materials III : symposium held November 30-December 3, 1992, Boston, Massachusetts, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 282
- 発行年:
- 1993
- 開始ページ:
- 523
- 終了ページ:
- 528
- 総ページ数:
- 6
- 出版情報:
- Pittsburgh, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558991774 [1558991778]
- 言語:
- 英語
- 請求記号:
- M23500/282
- 資料種別:
- 国際会議録
類似資料:
Materials Research Society | |
2
国際会議録
Si-N BONDING AT THE SiO2/Si INTERFACES DURING DEPOSITION OF SiO2 BY THE REMOTE PECVD PROCESS
Materials Research Society |
MRS - Materials Research Society |
3
国際会議録
Si-N BONDING AT THE SiO2/Si INTERFACES DURING DEPOSITION OF SiO2 BY THE REMOTE PECVD PROCESS
Materials Research Society | |
MRS - Materials Research Society |
Materials Research Society |
Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |