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THE EFFECT OF COPPER ON THE TITANIUM-SILICON DIOXIDE REACTION AND THE IMPLICATIONS FOR SELF-ENCAPSULATING, SELF-ADHERING METALLIZATION LINES

著者名:
掲載資料名:
Materials reliability in microelectronics II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
265
発行年:
1992
開始ページ:
205
終了ページ:
210
総ページ数:
6
出版情報:
Pittsburgh, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558991606 [1558991603]
言語:
英語
請求記号:
M23500/265
資料種別:
国際会議録

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