Blank Cover Image

RELIABILITY OF INTERCONNECTS EXHIBITING BIMODAL ELECTROMIGRATION-INDUCED FAILURED DISTRIBUTIONS

著者名:
掲載資料名:
Materials reliability in microelectronics II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
265
発行年:
1992
開始ページ:
65
終了ページ:
72
総ページ数:
8
出版情報:
Pittsburgh, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558991606 [1558991603]
言語:
英語
請求記号:
M23500/265
資料種別:
国際会議録

類似資料:

1 国際会議録 A STATISTICAL CHARACTERIZATION OF ELECTROMIGRATION INDUCED OPEN FAILURES IN 2-LEVEL METAL STRUCTURES

Kahn, H., Thompson, C. V.

Materials Research Society
7 国際会議録 Modelling of Failure Time Distributions for Interconnects Due to Stress Voiding and Electromigration

Wolfer, W. G., Bartelt, M. C., Dike, J. J., Hoyt, J. J., Gleixner, R. J., Nix, W. D.

MRS - Materials Research Society
2 国際会議録 Stress Voiding and Electromigration Failure in Multilevel Interconnect Metallization

Ho, P.S., Anderson, S.G.H., Yeo, I.S., Hu, C.K.

Electrochemical Society
8 国際会議録 Modeling of Electromigration-Induced Failure of Metallic Thin Films Interconnects

Maroudas, D., Gungor, R., Ho, H., Gray, L.

Electrochemical Society
3 国際会議録 Electromigration failure modes and Blech effect in single-inlaid Cu interconnects

Thrasher,S., Capasso,C., Zhao,L., Hernandez,R., Mulski,P., Rose,S., Nguyen,T., Kawasaki,H.

SPIE-The International Society for Optical Engineering
9 国際会議録 Multi-Via Electromigration Test Structures for Identification and Characterization of Different Failure Mechanisms

Choi, Z.-S., Chang, C.W., Lee, J.H., Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K.

Materials Research Society
4 国際会議録 Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects

Nichols,C.S., Smith,D.A.

Trans Tech Publications
10 国際会議録 On the reliability and failure of PBGA Interconnects under Bending Cyclic Test

Ho,S.H., Zheng,P.J., Wu,J.D., Hung,S.C.

IMAPS
5 国際会議録 Electromigration Damage and Failure Distributions in Al-4wt.%Cu Interconnects

Shih, W. C., Greer, A. L.

MRS - Materials Research Society
11 国際会議録 Experimental Studies Of The Reliability Of Interconnect Trees

Hau-Riege, S.P., Thompson, C.V.

Materials Research Society
6 国際会議録 Statistical Modeling and Experimental Verification of Electromigration Time to Fail Distribution in Metal Interconnects

Capasso, C., Gall, M., Anderson, S., Jawarani, D., Hernandez, R., Kawasaki, H.

Electrochemical Society
12 国際会議録 THE EFFECT OF THERMAL HISTORY ON INTERCONNECT RELIABILITY

Thompson, C. V.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12