Blank Cover Image

STABILITY OF SPUTTER DEPOSITED A1-Cu BILAYERS ON SiO2

著者名:
掲載資料名:
Advanced metallization and processing for semiconductor devices and circuits--II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
260
発行年:
1992
開始ページ:
929
終了ページ:
934
総ページ数:
6
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991552 [1558991557]
言語:
英語
請求記号:
M23500/260
資料種別:
国際会議録

類似資料:

1 国際会議録 STABILITY OF SILICIDE FILMS UNDER POST-ANNEALING: A DOPANT EFFECT

Shepard, C. L., Lanford, W. A., Pant, A. K., Murarka, S. P.

MRS - Materials Research Society
7 国際会議録 Characterization of Cu-Al Alloy/SiO2 Interface Microstructure

Wang, P.-I., Murarka, S.P., Yang, G.-R., Barnat, E., Lu, T.-M., Chen, Y.-C., Li, X., Ranjan, K.

Materials Research Society
2 国際会議録 INTERACTION OF Cu AND CoSi2

Shepard, C. L., Lanford, W. A., Shy, Y. -T., Murarka, S.

Materials Research Society
8 国際会議録 Characterization of Cu-Al Alloy/SiO2 Interface Microstructure

Wang, Pei-I., Murarka, S.P., Yang, G-R., Barnat, E., Lu, T-M., Chen, Y-C., Li, Xiang, Rajan, K.

Materials Research Society
3 国際会議録 INTERACTIONS AND STABILITY OF Cu ON CoSI2

Shy, Y. -Y., Murarka, S. P., Sitaram, A. R., Ding, P. -J., Lanford, W.A

Materials Research Society
9 国際会議録 Capacitance-Voltage, Current Voltage, and Thermal Stability of Copper Alloyed with Aluminum or Magnesium

Felipe, T. Suwwan de, Murarka, S. P., Bedell, S., Lanford, W. A.

MRS - Materials Research Society
4 国際会議録 Homogenization of the Bilayers of Cu-Al Alloy and Pure Copper to Produce Cu-0.3 at.% Al Alloy Films

Wang, Pei-I, Murarka, S. P., Bedell, S., Lanford, W. A.

MRS - Materials Research Society
10 国際会議録 INSTABILITIES IN THE MECHANICAL STRESS IN DEPOSITED SiO2 FILMS CAUSED BY THERMAL TREATMENTS

Bhushan, Bharat, Murarka, S. P.

Materials Research Society
5 国際会議録 Surface Passivation of Cu by Annealing Cu/Al Multilayer Films

Wang, W., Lanford, W. A., Murarka, S. P.

MRS - Materials Research Society
11 国際会議録 THE STABILITY OF TiH2 USED AS DIFFUSION BARRIER ON SiO2 SUBSTRATES

Murarka, Shyam, Ko, Sen-Hou, Ding, Pei-Jun, Lanford, William A.

MRS - Materials Research Society
6 国際会議録 INTERACTIONS OF COPPER WITH INTERLAYER DIELECTRICS AND ADHESION PROMOTERS/DIFFUSION BARRIERS

Arcot, B.., Shy, Y.T., Murarka, S.P., Shepard, C., Lanford, W.A.

Materials Research Society
12 国際会議録 GROWTH KINETICS AND MATERIALS PROPERTIES OF Cu5Si

Hymes, S., Murarka, S. P., Ding, P. J., Wang, W., Lanford, W. A.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12