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THERMAL STABILITY OF REACTIVELY SPUTTERED TiN AND InP AS A DIFFUSION BARRIER

著者名:
掲載資料名:
Advanced metallization and processing for semiconductor devices and circuits--II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
260
発行年:
1992
開始ページ:
561
終了ページ:
568
総ページ数:
8
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991552 [1558991557]
言語:
英語
請求記号:
M23500/260
資料種別:
国際会議録

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