Blank Cover Image

*CHEMICAL MECHANICAL POLISHING OF INTERLEVEL DIELECTRICS: MODELS FOR REMOVAL RATE AND PLANARITY

著者名:
掲載資料名:
Advanced metallization and processing for semiconductor devices and circuits--II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
260
発行年:
1992
開始ページ:
53
終了ページ:
66
総ページ数:
14
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991552 [1558991557]
言語:
英語
請求記号:
M23500/260
資料種別:
国際会議録

類似資料:

1 国際会議録 Modeling of the removal rate in chemical mechanical polishing

Nguyen,V.H., Shi,F.G.

SPIE-The International Society for Optical Engineering
7 国際会議録 The Effect of Slurry Composition and Flatness on Sub-Surface Damage and Removal in Chemical Mechanical Polishing of 6H-SiC

G.S. Lee, H.H. Hwang, C.H. Son, J.W. Choi, W.J. Lee

Trans Tech Publications
2 国際会議録 Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)

J.H. An, G.S. Lee, W.J. Lee, B.C. Shin, J.D. Seo

Trans Tech Publications
8 国際会議録 Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers

Lee, J.M., Cho, S.H., Park, J.G., Lee, S.H., Han, Y.P., Kim, S.Y.

SPIE-The International Society for Optical Engineering
3 国際会議録 CONSUMABLES FOR THE CHEMICAL MECHANICAL POLISHING (CMP) OF DIELECTRICS AND CONDUCTORS

Jairath, Rahul, Desai, Mukesh, Stell, Matt, Tolles, Robert, Scherber-Brewer, Debra

MRS - Materials Research Society
9 国際会議録 Characterization of the Chemical Interactions on Copper Chemical Mechanical Polishing

Lee, S.-M., Abiade, J., Choi, W., Singh, R.

Electrochemical Society
4 国際会議録 CHARACTERIZATION OF CHEMICAL-MECHANICAL POLISHING DIELECTRICS FOR MULTILEVEL METALLIZATION

Sun, S. C., Yeh, F. L., Tien, H. Z.

MRS - Materials Research Society
10 国際会議録 A Quantitative Model for Oxide Erosion in Chemical Mechanical Polishing of Tungsten

Yoon, B.U., Jeong, I.K, Kim, J.Y., Lee, J.W., Hah, S.R., Moon, J.T., Lee, S.I.

Electrochemical Society
5 国際会議録 Removal Rate, Uniformity and Defectivity Studies Of Chemical Mechanical Polishing of BPSG Films

Bonner, B.A., Fishkin, B., David, J., Garretson, C., Osterheld, T.H.

Materials Research Society
11 国際会議録 The Chemical-Mechanical Polishing of Copper with Model Slurries

Lee, B-C., Duquette, D.J., Gutmann, R.J.

Electrochemical Society
6 国際会議録 Removal Rate, Uniformity and Defectivity Studies of Chemical Mechanical Polishing of BPSG Films

Bonner, Benjamin A., Fishkin, Boris, David, Jeffrey, Garretson, Chad, Osterheld, Thomas H.

Materials Research Society
12 国際会議録 Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Su, J. X., Guo, D. M., Kang, R. K., Jin, Z. J., Li, X. J., Tian, Y. B.

Trans Tech Publications
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12