THE EFFECT OF DEPOSITION AND ANNEALING CONDITIONS ON THE MICROSTRUCTURE OF Al-Cu AND Al-Cu-Si THIN FILMS
- 著者名:
- 掲載資料名:
- Structure/property relationships for metal/metal interfaces : symposium held April 29-May 1, 1991, Anaheim, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 229
- 発行年:
- 1990
- 開始ページ:
- 313
- 終了ページ:
- 318
- 総ページ数:
- 6
- 出版情報:
- Pittsburgh, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558991231 [1558991239]
- 言語:
- 英語
- 請求記号:
- M23500/229
- 資料種別:
- 国際会議録
類似資料:
Materials Research Society |
Materials Research Society |
Electrochemical Society |
MRS - Materials Research Society |
Materials Research Society |
Materials Research Society |
Trans Tech Publications |
10
国際会議録
Effect of Substrate Surface Conditions on Electrochemical Performance of Si Thin Film Anode
Electrochemical Society |
5
国際会議録
GRAIN GROWTH PROCESSES DURING TRANSIENT ANNEALING OF As-IMPLANTED, POLYCRYSTALLINE-SILICON FILMS
Materials Research Society |
Electrochemical Society |
6
国際会議録
THE RELATIONSHIP BETWEEN DEPOSITION CONDITIONS, MICROSTRUCTURE AND PROPERTIES OF RE-TM THIN FILMS
Materials Research Society |
Trans Tech Publications |